JFS-9855S FIB Wafer Process Tool
Semiconductor devices with higher density are being developed at increasing speed. Cross sectional monitoring of IC wafers is becoming a more important means to inspect pattern design evaluation, defect review, and quality control in volume production of IC devices. In fact, cross sectional monitoring of IC wafers is an essential step in the production of 3 dimensional multi-layer micro devices.
The JFS-9855s Dual Beam System is a wafer process evaluation system capable of cross sectional milling and monitoring using a focused ion beam. The JFS-9855s comprises an ion optic system with a stable Ga liquid metal ion source and an electron optic system with a high brightness thermal field emission gun. It features a high speed stage, single wafer auto loader, and other automated controls such as auto focus, auto stigmator, auto contrast, and auto brightness, collectively achieving higher throughput.
Features
- Milling by focused ion beam
The Ga liquid metal ion source, combined with the 3 stage irradiation lens, achieves an ion beam with a minimum beam size of 10 nm. This fine beam grinds out rectangular areas of an IC to create a cross section.
- High quality SEM imaging
The thermal field emission gun, featuring high stability and minimum noise, enables scanning imaging with high resolution and high S/N ratio. Positioned at an angle of 60° from the ion optic system, the electron optic system allows the operator to monitor a cross sectional SEM image without tilting the wafer immediately after creating a cross section with an ion beam.
- Standard auto loader
Two sizes of wafers, 6" and 8", are observed. The auto loader is standard for quick and easy wafer exchange, eliminating the complex manual wafer loading process.
- High throughput
Use of the high speed stage, evacuation system, and wafer loader results in higher throughput. Also, functions such as die-by-die step and quick image centering bring a desired area of view instantly.
- User friendly operation
System and operation status are displayed in color graphics to facilitate operation. Automated functions such as auto focus, auto stigmator, auto contrast, and auto brightness are further enhanced.
- Job scheduling
The operator can preprogram positions and conditions for milling and imaging by creating a recipe file. During scheduled operation, the operator can add imaging or milling at any time.
- Minimized contamination and damage
The wafer loading system uses a robot arm with no sliding parts (for in and out of vacuum), preventing particle buildup on wafers. The evacuation system uses a turbo molecular pump (TMP) and sputter ion pump (SIP) to minimize carbon contamination on wafers. The entire system meets clean room specifications. During stage movement and imaging, ion and electron beams are automatically blanked to minimize the beam damage on the wafer.
- Easy maintenance
The gun is replaced with a pre-tuned gun when the emitter of the electron gun needs to be exchanged. Similarly, the emitter unit for the ion gun is replaced. A series of maintenance programs are available to facilitate the upkeep of the system.
- Support of CIM
A data linkage program is available as an accessory to connect the system with optical defect review devices and support CIM (Computer Integrated Manufacturing System) of individual process lines. The wafer loading mechanism is designed to facilitate transfer of carriers by robot.
Defect Images
The following are surface images of an embedded defect, SEM and SIM images after the sample was cross sectioned by a focused ion beam.
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SEM image taken at a tilt angle of 60° |
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Cross sectional SEM image after FIB milling |
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Cross sectional SIM image after FIB milling
(SEI excited by ions) |